1 Oct 2026

PACK EXPO AND CIBUS TEC 2026

From Chicago to Parma: Atlanta Group brings end-of-line innovation to PACK EXPO and Cibus Tec 2026

 

Two international events, one shared vision: making end-of-line packaging more reliable, automated, connected and sustainable, with solutions that address real production needs.

 

Two trade shows, one shared vision for the future of packaging

October will take Atlanta Group from Chicago to Parma. PACK EXPO and CIBUS TEC  2026 will provide two opportunities to connect with different markets and showcase a common direction: end-of-line systems that are increasingly integrated, autonomous and adaptable to production needs.

Innovation goes beyond increasing speed or productivity. Today, it means looking at the entire process: reducing interruptions, simplifying operators’ tasks, increasing flexibility, improving access to data and designing technologies that retain their value over time.

This is the approach Atlanta Group will bring to both October events, with new solutions and technological developments to be unveiled at the shows.

 

PACK EXPO Chicago: innovation for a global market

In Chicago, Atlanta Group will meet the North American market with solutions that reflect the growing integration of automation and end-of-line technologies. The focus will be on systems that adapt to different production environments, reduce manual tasks and enable smoother, more autonomous processes.

The presence of Atlanta Packaging North America also reinforces a central part of the Group’s strategy: combining a global manufacturing perspective with local support, close to customers and their operational needs.

 

 

 

CIBUS TEC Parma: automation and production continuity for the food industry

Just a few days later, CIBUS TEC in Parma will offer a different application context. Here, the focus will be on the needs of the food and beverage industry, where production continuity, reliability and end-of-line integration play a decisive role.

Atlanta Group will present new developments designed to extend automation beyond individual machine cycles and improve the efficiency of the overall process.

 

 

Five priorities shaping the future of end-of-line packaging

The innovations Atlanta Group will bring to the shows are part of a broader development strategy built around five themes that guide our solutions.

 

  • Quality & Reliability

Technologies designed to deliver robust performance, precision and long-term production continuity, with a manufacturing approach focused on quality and process reliability.

 

  • Service Excellence

Innovation continues after installation. Technical assistance, specialist expertise, remote support and an international service network support customers throughout the solution’s lifecycle.

 

  • Automation & Robotics

Automation and robotics make it possible to rethink tasks that still rely on manual or repetitive work, increasing autonomy, flexibility and integration across the different stages of the end-of-line process.

 

  • Digitalization & Connectivity

Increasingly connected machines and systems turn data into a practical tool for process monitoring, technical support and production optimization.

 

  • Sustainability

Efficiency also means making better use of materials, energy and resources. Sustainability is therefore part of the design process, supporting a manufacturing approach focused on process optimization and waste reduction.

 

Innovation engineered around the process

PACK EXPO and CIBUS TEC are two very different trade shows, but they will showcase the same Atlanta Group: a group that develops technologies around real production needs and sees end-of-line packaging as an ecosystem in which machines, automation, people, data and service must work together.

 

What’s new? We’ll reveal it at the shows.

 

From Chicago to Parma, join us to discover the next step in Atlanta Group innovation.

 

Meet us at PACK EXPO 2026 in Chicago and CIBUS TEC 2026 in Parma to see Atlanta Group’s latest end-of-line technologies firsthand.

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